Sunstar boasts industry‑leading automated TO‑CAN packaging production lines with a monthly capacity of 2 million units. Its laser and receiver portfolio covers EML, DML, FP, VCSEL, PD, PIN‑TIA, APD‑TIA and Super‑TIA, supporting 2.5G, 10G, 25G, 100G in both NRZ and PAM4 formats. Multiple TO header packages including TO56, TO38, TO46 and TO33 are available to meet packaging requirements for SFP, XFP, SFP+, QSFP+, SFP‑DD, QSFP28 and QSFP‑DD optical devices and transceiver.